| 【Conference】 |
| JIEP, 18 March 2015 |
”Combined Surface Activated Bonding Technologies for New Approach to Low
Temperature Wafer Bonding”
Joint paper: Tadatomo Suga, Professor of School of Engineering, The University
of Tokyo |
| 【Conference】 |
| ECS2014 in CANCUN, 8 October 2014 |
”Combined Surface Activated Bonding Technologies for New Approach to Low
Temperature Wafer Bonding”
Joint paper: Tadatomo Suga, Professor of School of Engineering, The University of Tokyo
|
| 【Award】 |
| Excellence technology Prize for a medium sized company in Kyoto, 25 February 2012 |
| “Surface activated bonder for large diameter semiconductor wafer” |
| 【Media】 |
| Nikkan Kogyo Shimbun, 28 October 2011 |
| “Challenge of an innovative company in Kyoto. “Alignment is a key technology.” |
| 【Media】 |
| Electronic journal, 5 August 2011 |
| “Wafer bonder in the 2011 micromachine/MEMS technology” |
| 【Media】 |
| Japan Chemical Daily。3 June 2011 |
| “The room temperature bonding technology for inorganic wafer is used for
3D stack etc.” |
| 【Media】 |
| Japan Chemical Daily, 3 June 2011 |
| “Room temperature bonding by nano adhesive layer.” |
| 【Lecture】 |
| Mitsubishi-UFJ Technology Development Foundation, 16 February 2011 |
| “Unique technology of alignment for semiconductor equipment and Bondtech
business model” |
| 【Media】 |
| The Kyoto Shimbun, 15 February 2011 |
Konnichiwa laboratory
“Make an attempt at extremely small bonding technology” |
| 【Media】 |
| Nikkan Kogyo Shimbun, 22 July 2010 |
| “A new surface activated bonding system from Bondtech, released by Marubeni
Information Systems” |
| 【Media】 |
| The Nikkei, 1 July 2010 |
| “Make it possible to stacked chip in low temperature” |
| 【Media】 |
| Nikkei business daily, 21 June 2010 |
“Wafer and wafer bonding, high accuracy, correction of a position by IR and process reduction.”
|
| 【Media】 |
| Nikkei business daily, 25 May 2010 |
| “Multi layers semiconductor equipment. Chip place within 0.2 um accuracy.” |
| 【Conference】 |
| JIEP, 12 March 2010 |
| “Development of high precision high vacuum bonding system” |
| 【Lecture】 |
| Japan photo fabrication association, 16 February 2010 |
“Technology trend and foresight for camera module in cell-phone.”
“Room Temperature 3D packaging by Surface Activated Bonding and UV imprint
technology (CIS Lens forming and Wafer Level Packaging)” |
| 【Lecture】 |
| NE Academy, 18 November 2009 |
Nikkei micro device seminar
“Low temperature and low pressure bonding technology.
4 types of surface activated method and high accurate alignment for Mass production” |
| 【Media】 |
| International Journal, November 2009 |
| “Venture company, Bondtech, having development power at the cutting edge
of innovative technology” |
| 【Media】 |
| Electronic Device Industry News, 5 August 2009 |
“Bondtech, venture company for bonding system started.
High precision alignment technology of Bondtech expands the business to
MEMS and 3D packaging as well as CIS.” |
| 【Media】 |
| Electronic journal, August 2009 |
| “Alignment & bonding system for Micro machine/MEMS” |
| 【Conference】 |
| SEMI SIS2008, 3 November 2008 |
| “Surface Activated Bonding Technology and MEMS application” |
| 【Conference】 |
| ECS2008 Honolulu, 12 October 2008 |
10th International Symposium on Semiconductor Wafer Bonding Science, Technology and Applications
“Hybrid Bonding (Plasma activation and Anodic bonding) for Vacuum Sealing”
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