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WA1000
Wafer Bonding 12” R&D equipment
WFP2000
Multi SAB wafer Bonder
WF1500
Room Temperature Bonding
Mass Production Equipment
WP2000
Plasma a anodic bonding
R&D equipment
WS1500
Ar SAB Bonding
Mass Production Equipment
WP1500
Anodic Bonding Production Equipment
WAP100
SAB Process R&D equipment
HBWS3000
Vacuum hydrophilic bonding system
for 12 inch wafer for CIS
Mass Production Equipment
WM1500
Resin Bonding
Mass Production Equipment
HBCW3000
Mass Production Equipment
for Hybrid bonding
GB3000
（COW→WOW Integration System）
SCA1000
High Accuracy COC Bonder
CG100
Cu reductive Activation Bonding System
NI2000
High accuracy UV Nano Imprint
system
SR2000
High accuracy UV Nano Imprint
S&R system
