WA1000
Wafer Bonding 12” R&D equipment

MFP2000
Plasma Surface Activated Bonding
Mass Production Equipment

WF1500
Room Temperature Bonding
Mass Production Equipment

WP100
Plasma Bonding R&D equipment

WS1500
A/Solde/SAB Bonding
Mass Production Equipment

WP1500
Anodic Bonding Production Equipment

HBCW3000
COW mass production system
　　that support Hybrid Bonding

GB3000
（COW→WOW Integration System）

SCA1000
High precision COC bonder

CG100
Cu reductive activation bonding system

NI2000
Automatic Tensile Tester in Vacuum
Mass Production Equipment

SR2000
High precision UV nanoimprint S&R