bondtechボンドテックについてテクノロジーマーケットプロダクト

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WI1000
Wafer Bonding 12” R&D equipment

WS1000
Plasma Surface Activated Bonding
Mass Production Equipment

WF1500
Room Temperature Bonding
Mass Production Equipment

WP100
Plasma Bonding R&D equipment

WS1500
A/Solde/SAB Bonding
Mass Production Equipment

WP1500
Anodic Bonding Production Equipment

WAP100
SAB Process R&D equipment

WS3000
Vacuum hydrophilic bonding system
for 12 inch wafer for CIS
Mass Production Equipment
WM1500
Resin Bonding。
Mass Production Equipment



SCW3000
High Alignment Acyuracy
Mass Production Equipment

CW3000
Surface Activated Bonding System
for COW

GB3000
(COW→WOW Integration System)



SCA1000
High precision COC bonder

CG100
Cu reductive activation bonding system




NI2000
Automatic Tensile Tester in Vacuum
Mass Production Equipment

SR2000
High precision UV nanoimprint S&R


Product
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