bondtechボンドテックについてテクノロジーマーケットプロダクト

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Bondtech develops and supplies manufacturing system for Semiconductor, MEMS (Micro Electro Mechanical Systems) devices and nanoimprint, with proprietary ultra high accurate alignment technology. Our advanced system achieved Ten Nanometer alignment with Piezo-6axis alignment system and the recognition system called "MagicVision" to precisely recognize position image by infrared-transparent .
Under the guidance by Professor Tadatomo Suga of Tokyo University who has leaded the surface activated room temperature bonding technology, which is the key technology to semiconductor three-dimensional multilayer method, we developed the bonding process system at the wafer-level with surface activation technology. By this technology, it can be realized that mass-production of three-dimensional LSI, low temperature (around 150 degree Celsius) wafer or chip bonding in low vacuum or in the air. Its bonding technology helps to make MEMS hybrid devise. *1)We select better surface activation bonding techniques most suitable to bond different semiconductor materials such as Au, Cu, Si and glass. *2)onventional photolithography semiconductor manufacturing has come to the limitation in the high integration and speed for the electric circuit. Bondtech's technology helps semiconductor wafer / chip bonding and three-dimensional LSI mass-production. MEMS device has structural movable parts. The bonding technology provides easier integration with electric circuit. Previously it is difficult to integrate on a chip in mass-production manufacturing line because the material is deferent. Bondtech also has been developing nano-in-print that is nanometer pattern transcriptional equipment by photo-polymer. In the near future it is expected that existing photolithography method would be transferred to nano-in-print method in semiconductor / MEMS manufacturing technology, and three-dimensional stacking by wafer bonding technology. With our technology, customer just changes stepper to nano-in-print, and applying wafer bonding technology at the end of front-end wafer processing equipment, then gets the advance manufacturing technology without changing production method.
代表取締役社長 山内朗
経営理念
I established Bondtech that a company has the unique and proprietary technology, started from a venture-incubate-room after "Sozo" law authorization by Japanese government. Clear decision in offense and defense helped the company to grow in investment for the research and development with cost reduction at the same time. Always improving the own strengths over the others, maintaining the speed as our company's lifeline, we have executed forward developing the new fields.

The strength of bondtech is not an equipment supplier but a member of the research consortium which helps to determine the future of the research activities. We sometimes make a proposal by ourselves from the live information.

We are based on "fab-less" and made up by a few members to be the best players.
uPrint_img会社概要
会社名 Bondtech Co., Ltd.
Establishment 21, April, 2004
Paid-in Capital 47million yen
President Akira Yamauchi
Address Head quarters:77, Ishiharanisimachi, kisshoin, Minami-ku, kyoto 601-8366 Japan
TEL: +81-075-748-6180 FAX: +81-075-748-6179
Description of Business Manufacture, development and sale for Bonder and nano system for MEMS and semiconductor
History of development 2008Anodic Bonder with Fine Alignment in Vacuum for Vacuum Lock of Wafer“WA1000”
2004 High precision Chip Aligner “CA300”
2005 High precision vacuum wafer aligner “WA9000”
2006 Surface Activated Wafer Bonding Kit for R&D “WP-100”
2007 Plasma Surface Activated Bonding Cassette to Cassette Full Automation System, for Mass Production “WS1000”
2006-2007 NEDO 2006-2007 Grant for Venture Project “20nm Precision Alignment”
2008 Ultra High Vacuum Surface Activated Bonding System “SAB1000”
2009 Automatic Tensile Tester in Vacuum  “NI1000”
2010 High precision COW for Mass Production “SCW1000”
2011 High precision UV nanoimprint S&R “SR1000”
2012 Surface activated WOW system for 12 inch (Optional; vapor assist, Si sputter)
2013 High precision COC bonder “SCA1000”
2014 Cu reductive activation bonding system “CG100”
2015 Vacuum hydrophilic bonding system for 12 inch wafer for CIS mass production
“WS3000

Committee of the Japan Institute of Electronics Packaging, Kansai branch
Auditor and Board member of Institute for Advanced Micro-system Integration (IMSI)
Member of the 3D wafer bonding
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